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TGV laser drilling equipment

Equipment Function: This equipment is designed for micron-level micro-hole fabrication in advanced packaging and displays. Its core technology employs a two-step process: ultrafast laser (picosecond/femtosecond) + wet etching.

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Product Description

Equipment Function: This equipment is designed for micron-level micro-hole fabrication in advanced packaging and displays. Its core technology employs a two-step process: ultrafast laser (picosecond/femtosecond) + wet etching. It mass-produces through-holes and blind vias on glass substrates, meeting the demands for small apertures, high aspect ratios, crack-free surfaces, high consistency, and high throughput.

It supports arbitrary trajectory and hole shape designs, enabling the fabrication of hourglass-shaped holes, non-tapered holes, etc. Laser parameters are adjustable, allowing for precise control of perpendicularity, morphology, and consistency.

Wide Application Areas: Primarily used in advanced semiconductor packaging, MEMS sensing, Mini/Micro LED, and medical optoelectronic devices.

Sample Images
TGV laser drilling equipment

Equipment Parameters

Product Name	TGV laser drilling equipment
Processing Size	6-12 inches, customizable
Accuracy	XY axis positioning accuracy	±0.003
	XY repositioning accuracy (mm)	±0.002
	Z-axis positioning accuracy (mm)	±0.02
	Z Repositioning Accuracy (mm)	±0.01
Laser Sourse	Laser type	Infrared femtosecond
Laser Sourse	Laser power (W)	≥30W
Process Parameters	Hole type	Through-hole, blind hole, conical hole
	Aspect ratio	100:1
	Hole Diameter range (μm)	10-200
	Glass thickness (mm)	0.2–1.5
	Hole Roundness	≥90%
	Diameter tolerance （μm）	±3–5 μm
	Processing Speed	1000–5000 holes per second
Equipment Dimension	210022502200 (length, width, height)
Weight	Approximately 4 tons

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TGV laser drilling equipment