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PCB laser cutting equipment

Equipment Function: This equipment utilizes a high-energy laser beam for precision cutting, depaneling, drilling, and window opening of printed circuit boards (PCB) and flexible printed circuits (FPC). It enables stress-free, burr-free, and high-precision circuit board separation and micro-pattern processing.

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Product Description

Equipment Function: This equipment utilizes a high-energy laser beam for precision cutting, depaneling, drilling, and window opening of printed circuit boards (PCB) and flexible printed circuits (FPC). It enables stress-free, burr-free, and high-precision circuit board separation and micro-pattern processing.?

As a high-precision cold processing system, it is especially suitable for complex, miniature, and highly integrated circuit boards that are difficult to process using traditional mechanical methods such as milling cutters or stamping dies.?

Wide Application Areas: ?Primarily used for printed circuit boards (PCB) and flexible printed circuits (FPC).

Sample Images

PCB laser cutting equipment

Equipment Parameters

Product Name	PCB laser cutting equipment
Processing Size	300*300mm, customizable
Accuracy	XY axis positioning accuracy (mm)	±0.003
	XY repeat positioning accuracy (mm)	±0.002
	Z axis positioning accuracy (mm)	±0.01
	Z axis repeat positioning Accuracy (mm)	±0.005
Laser	Laser type	UV 355 nm
	Laser power (W)	≥15
Process Parameters	Minimum processing line width (mm)	≤0.03
	Lens processing area（mm）	≥50
Maximum Platform acceleration	1G
Comprehensive Machining Accuracy	±0.02mm
Maximum Platform Speed	1000mm/s
Outline Dimension	145014502200 (length, width, height)
Weight	Approximately 2 tons

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PCB laser cutting equipment