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Debonding equipment

Equipment Function:This process is based on UV nanosecond laser technology combined with flat-top beam shaping. The laser is transmitted through carrier substrates such as glass to uniformly irradiate the temporary bonding adhesive layer, precisely inducing adhesive debonding and enabling cold separation of the wafer from the carrier substrate. This significantly reduces the risk of structural dam

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Product Description

Equipment Function: This process is based on UV nanosecond laser technology combined with flat-top beam shaping. The laser is transmitted through carrier substrates such as glass to uniformly irradiate the temporary bonding adhesive layer, precisely inducing adhesive debonding and enabling cold separation of the wafer from the carrier substrate. This significantly reduces the risk of structural damage caused by mechanical stress to ultra-thin device wafers such as SiC and GaN.?

Wide Application Areas: Mainly used in the semiconductor wafer industry.

Sample Images

Deconstruction equipment

Equipment Parameters

Product Name	Laser debonding equipment
Processing Size	Compatible with 4-inch, 6-inch, 8-inch, and 12-inch wafers
Scanning Accuracy	Straightnes (μm/m)	＜5
	Repeat positioning accuracy (mm)	±0.002
Laser	Wavelength （nm）	1550
	Laser power (W)	≥10W
Process Parameters	Processing line width (mm)	custom made
	Beam uniformity	>90%, square spot
Platform Flatness	< 30 μm
Processing Speed	≥2000mm/s
Outline Dimension	185018502200 (length, width, height)
Weight	Approximately 1.9 tons