Equipment Function: The green laser drilling equipment is a high-precision cutting tool specifically designed for micro-hole machining of hard and brittle materials (such as glass, sapphire, and ceramics).
Product Description
Equipment Function: The green laser drilling equipment is a high-precision processing system specifically designed for micro-hole machining of hard and brittle materials (such as glass, sapphire, and ceramics). It utilizes a 532nm wavelength green laser and a unique bottom-up, layer-by-layer removal process, solving the industry problem of material edge chipping and cracking caused by traditional mechanical drilling.
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Wide Application Areas: Primarily used for glass, sapphire, ceramics, silicon wafers, etc.
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Sample Images

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Equipment Parameters
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Product Name |
Green glass drilling equipment |
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Processing Size |
300x300, customizable |
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Accuracy |
XY axis positioning accuracy |
±0.003 |
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XY axis repeat positioning accuracy (mm) |
±0.002 |
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Z-axis positioning accuracy (mm) |
±0.02 |
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Z axis repeat positioning accuracy (mm) |
±0.01 |
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Laser |
Laser type |
Green nanosecond laser |
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Laser power (W) |
10W-40W |
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Process Parameters |
Hole type |
Through-hole, blind hole, conical hole |
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Aspect ratio |
5:1 |
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Minimum hole diameter?(mm) |
0.1 |
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Glass thickness (mm) |
0.2–19 |
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Circle Roundness |
≥90% |
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Edge chipping size?(μm) |
<100 |
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Dimensions |
1450*1450*2200 (length, width, height) |
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Weight |
Approximately 2 tons |
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E-mail: mkxn@szmicrotreat.com
Tel.: +86 512 8391 9217
Tel.: +86 173 1528 3532
Tel.: +86 188 6210 4169
WhatsApp: +8618015504961
Add.: Unit 101, Building 63, Suzhou Nano City, No. 99 Jinji Lake Avenue, Suzhou Industrial Park, Suzhou