The film cutting machine is specially designed for high-precision electronic material processing, using laser technology, Supports micron-level cutting (accuracy ≤10 μm) for a wide range of film materials, including PET films, OCA optical adhesive films, and flexible printed circuits (FPCs), suitable for 0.01-2mm thickness, narrow melting edge, and low thermal damage. Integrated visual positioning and process library, complex graphics can be switched with one click, cutting speed ≥200mm/s, yield ≥99.5%. Fully enclosed negative pressure dust removal system ensures cleanliness, compatible with automatic loading and unloading of coils/sheets, daily average production capacity increased by 3 times, helping consumer electronics, display panels and other industries to achieve high-quality, high-efficiency and low-carbon production.

Working Principle of?Film Laser Cutting Machine

The film laser cutting machine operates based on precision laser scanning & CCD vision positioning:

1. CCD Vision Alignment
   High-power telecentric lens and industrial camera automatically detect film edges, marks, or fiducials, ensuring micron-level alignment.

2. Laser Processing
   High-energy laser beam precisely performs full cutting or half-cutting depending on material and product needs.

3. Motion Control System
   Driven by a precision linear module with max speed up to 500mm/s.

4. Vacuum Adsorption Platform
   Ensures film stays perfectly flat during cutting; platform available in aluminum or honeycomb options.

5. Real-time Monitoring & Remote Support
   Windows 11 control system with TeamViewer remote access enables easier maintenance and upgrades.

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Specifications

1. Product size: 1600mm*1300mm and below
2. Industrial camera equipped with high-power telecentric lens, CCD positioning accuracy ≤±3μm
3. Processing object: Laser full cutting and half cutting of film materials
4. Processing type: straight line or special shape
5. Maximum cutting speed 500mm/s (depending on the material)
6. Maximum moving speed 500mm/s
7. Cutting platform: vacuum adsorption platform (made of aluminum or honeycomb board)
8. Melt edge: ≤150um
9. File formats that can be processed: standard Gerber files, DXF files, DWG files, etc.
10. Windows 11 control PC, 21.5-inch monitor
11. TeamViewer remote access
12. Installation and training on site by Microtreat staff
13. Dust is collected by dust collector, exhaust flow: >200m3/h, duct diameter: ￠100mm
14. Compressed air Pressure: 0.5～0.7Mpa, flow rate: <200L/min, compressed air pipe diameter: ￠10mm
15. Marble base and metal welded frame
16. Ground feet with seismic isolation function
17. Dimensions: 2400mm×2200mm×2600mm (subject to the actual product), 3000kg
18. Rated power 12KW
19. 3-color status signal tower

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Highlights?

1. Processing according to the drawing, one-time molding
2. Fast cutting speed, no black edges, no burrs
3. Use visual alignment to achieve high-precision cutting
4. No tool consumables, low operating costs
5. 7×24 hours continuous cutting without attenuation

Features

1. Use CO2 laser to focus μm-level spot to cut flexible film layer
2. High-precision linear motor working platform, high precision and fast speed
3. CCD automatic positioning and automatic correction can be selected; honeycomb board adsorbs fixed board, no need for alternative fixtures
4. The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time
5. Compatible with special-shaped pattern cutting

6.Strong compatibility: compatible with all types of PCB/OLED/flexible circuit films, equipment reuse rate increased by 70%, initial cost directly reduced by 50%+.
7.Zero consumables: non-contact laser cutting, zero die loss, annual consumables savings of more than 800,000+.
8.Agile response: pattern library switching in seconds, order conversion time <2 minutes, no worries about fragmented production.
9.Equipped with dust collection module: fully enclosed negative pressure dust removal.
10.Ultra-long standby: 7×24 hours continuous cutting without attenuation, laser life ≥80,000 hours, operation and maintenance costs reduced by 60%.

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Applications of?Film Laser Cutting Machine

1. Flexible Perovskite Component Manufacturers

• Thin-film photovoltaic cell patterning

• P1/P2/P3 laser scribing

• Flexible module edge trimming

• Multilayer coating film separation and shaping

2. SPD and PDLC Dimming Film Manufacturers

• Smart dimming film contour cutting

• Full-cut and half-cut of multilayer liquid crystal films

• Microscale alignment cutting for switchable glass modules

3. High-end Flexible Material Processing

Applicable across multiple industries requiring precision film cutting:

• Consumer electronics: protective films, optical films, touch panel layers, FPC cover layers

• Semiconductors: wafer protection films, encapsulation films, sensor films

• Medical devices: biomedical films, microfluidic films, diagnostic strip materials

• Automotive electronics: HUD films, functional interior films, sensor protection films

4. Battery & Energy Storage Materials

For other types of battery separator films and functional coated films, customized laser solutions are available. Please consult our technical team for detailed application matching.

5. General High-Precision Film Cutting

Across all industries requiring:

• Complex-shape contour cutting

• Burr-free edges

• Minimal thermal impact

• High-speed industrial batch processing

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Problems Solved

Ultra-precision cutting

• Achieves ≤±3 μm alignment accuracy

• Ensures consistent edge quality with melt edge ≤150 μm

Higher efficiency & automation

• 500mm/s high-speed cutting

• Automated CCD mark recognition reduces manual labor

Improved yield rate

• Eliminates burrs and deformation common in mechanical cutting

• Enhanced repeatability with marble base & vibration isolation

Clean, dust-free processing

• Professional dust collector prevents contamination in semiconductor and PV applications

Supports complex shapes

• Easy importing of Gerber, DXF, and DWG enables flexible product design

Options

1. Local power
>208V/60Hz
>480V/60Hz
2. Power selection
>CO2 output power: 60W~300W
3. Contact us to learn about your specific needs

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Film Laser Cutting Machine Manufacturer

• Established in 2021 as a high-tech enterprise, technology-based SME, and innovative SME.

• Specialized in ultra-precision laser equipment for new energy and semiconductor industries.

• Over 2,500 m2 clean manufacturing facility, supporting high-end, contamination-controlled production.

• Industry leadership: Holds over 70% market share in perovskite thin-film photovoltaic laser processing equipment.

• Key contributor to major provincial R&D projects, including Jiangsu’s program on large-area laminated thin-film PV module industrialization.

• Strong R&D capability with a fully independent optical, mechanical, electrical, and software engineering team.

• Backed by capital strength: Secured tens of millions RMB in angel investment in 2022, led by Oriental Fortune, accelerating R&D and capacity expansion.

• Extensive global collaboration with top universities and leading photovoltaic module manufacturers.

• Aligned with national energy goals, actively supporting the “3060 Dual Carbon” strategy and advancing clean energy equipment industrialization.

• Comprehensive service network, offering global technical support, installation, training, and continuous innovation for thin-film solar customers worldwide.