1. Fully functional: compatible with P1-P3 scribing, P2.5/P4 edge cleaning, glass cutting and cracking functions;
2. Fully automatic loading and unloading: with robot module and monitoring system, the product can be automatically loaded and unloaded;
3. Ultrafast laser single machine multi-purpose: using optical devices such as splitter lenses, a single beam is divided into two paths, respectively with focusing mirrors and galvanometer field mirror systems to achieve different functions;
4. Stacked axis platform: reduce the error caused by the flying light path and improve the accuracy of the equipment;
5. Separable processing platform: after the cutting and cracking is completed, the platform drives the cut small pieces of glass to automatically spread out, which is convenient for the robot to grab;

Multi-function fully automatic etching and cutting system machine
The fully automatic etching and cutting system machine is customized and developed through a special optical shaping system and processing software to achieve high-speed and stable cutting and etching of perovskite rigid glass; equipped with an automatic image positioning system to provide guarantee for the automatic high-speed operation of the product, and can be equipped with robots and loading and unloading modules to achieve automatic loading and unloading processing and improve production capacity.

Highlights
1. Ultrafast laser beam splitting, one machine for multiple uses, reducing costs and floor space;
2. The size of the processed product is fixed and can be customized;
3. Fully automatic loading and unloading, compatible with P1-P3 scribing, P2.5/P4 edge cleaning, glass cutting and cracking functions;
4. The narrowest line width of scribing can be 15um, and the edge cleaning width is adjustable from 1 to 20mm.
5. There are a variety of laser wavelengths and pulse widths (ns/ps/fs) to choose from.
6. The software is highly open source and can edit the process independently to meet different process requirements.

Features
1. Semi-automatic and fully automatic operation modes, switchable;
2. Customized semi-automatic mode for efficient testing;
3. Advanced machine vision positioning system, equipped with high-precision CCD camera.
4. XY axis stacking can perform interpolation movement.
5. Equipped with a variety of lasers, with complete functions;
6. The heat-affected area of ????marking is small, and the crater height is low; the cutting edge is small and there is no crack;
7. Equipped with a product detection system.

Applications
1. Conductive glass cleaning and cutting
2. Scribing, cleaning and cutting of perovskite single stack cells
3. Suitable for R&D and small batches
4. For other battery materials, please consult our relevant personnel

Specifications
1. Product size: maximum 100x100mm, custom sizes supported
2. Industrial camera equipped with high-magnification telecentric lens, CCD positioning accuracy ≤±3μm
3. Rigid glass thickness: 0.7-3.2mm;
4. X/Y stacking axis positioning accuracy ≤±3μm, repeatability ≤±2μm
5. Maximum processing speed: 500mm/s
6. Cutting size accuracy ≤±5μm, scribing position accuracy ≤±10μm
7. Scribing, cleaning single-side thermal impact ≤10μm
8. Crater height: P1/P2≤20nm, P3≤200nm (determined by material), cutting edge collapse ≤50μm
9. File formats that can be processed: standard Gerber files, DXF files, DWG files, etc.
10. Windows 11 control PC, 21.5-inch monitor
11. TeamViewer remote access
12. Installation and training by Microtreat staff on site
13. Dust is collected by dust collector, exhaust flow: >200m3/h, air duct diameter: ￠100mm
14. Compressed air pressure: 0.5~0.7Mpa, flow: <200L/min, compressed air pipe diameter: ￠10mm
15. Marble base and metal welding frame,
16. Ground feet with seismic isolation function
17. Overall dimensions: 1900mm×2400mm×2000mm, 2500kg (100x100mm processing platform)
18. Rated power 15KW, average power 11KW
19. 3-color status signal tower
20. Can be used UL certified
21. With four-axis manipulator and safety light curtain

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Multiple laser wavelengths for optimal material absorption
>355nm 15W output power
>532nm 15W output power
>1064nm 20W output power
3. Lasers with different pulse widths: nanosecond fiber lasers, picosecond, femtosecond and other ultrafast lasers
4. Contact us to learn about your specific needs