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Silicon wafer cell cutting equipment (damaging, non-damaging)

Equipment Function: A two-in-one laser cutting system for solar silicon wafers, combining destructive and non-destructive laser cutting.

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Product Description

Equipment Function: A two-in-one laser cutting system for solar silicon wafers, combining destructive and non-destructive laser cutting.

Non-destructive Laser Cutting: Utilizes laser heating and cooling (or the inherent characteristics of ultrafast lasers) to generate localized thermal stress on the silicon wafer surface, guiding precise crack propagation and achieving non-destructive separation.

Destructive Laser Cutting: Uses a focused high-energy laser beam to ablate material layer by layer along a predetermined path on the silicon wafer surface, forming grooves and ultimately cutting through.

Wide Applications: Used for dicing (cutting) monocrystalline and polycrystalline silicon solar cells.

Sample Images

Silicon wafer cell cutting equipment (damaging, non-damaging)

Equipment Parameters

Product Name	Silicon wafer cell cutting equipment (damaging, non-damaging)
Finish Size	≤210*210mm
Accuracy	Impaired cutting accuracy (μm)	≤±30
Accuracy	Non-destructive cutting accuracy (μm)	≤±100
Laser	Non-destructive laser types	Infrared nanosecond
	Non-destructive laser power (W)	≥50W
	Types of damage lasers	P picosecond ultraviolet/P picosecond green light
	Power of the laser with damage (W)	≥30W
Process Parameters	Cutting thermal ablation width (μm)	≤50
Outline Dimension	(2300 mm × 1100 mm × 2200 mm in length, width, and height)
Weight	Approximately 2 tons