Laser technology plays a key role in the field of 3C consumer electronics. Its high-precision, high-efficiency and non-contact processing characteristics have significantly promoted product innovation and process upgrades.

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In terms of glass cutting and drilling, ultrafast lasers (picosecond/femtosecond) achieve micron-level processing with extremely short pulses. They are widely used in special-shaped cutting and micro-hole processing of mobile phone covers, camera lenses, etc., avoiding fragmentation caused by traditional mechanical stress, and the edges are smooth without secondary processing.

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In FBC processing (flexible circuit board precision processing), lasers are used for micro-hole drilling, circuit forming and chip welding of FPC, accurately controlling the heat-affected zone, ensuring the reliability of high-density circuits and the miniaturization requirements of flexible electronic components.

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Laser marking replaces ink printing with permanent marking, etching serial numbers, LOGO or anti-counterfeiting codes on materials such as metal and plastic, which is both environmentally friendly and wear-resistant, and adapts to the trend of personalized appearance of electronic products.

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In addition, laser technology has also penetrated into welding, cleaning and surface treatment, helping 3C products to iterate towards thinness and intelligence. Its efficient and flexible processing method not only improves production yield, but also promotes the industry to develop towards green manufacturing and high-end customization, and continues to meet the dual needs of the consumer electronics market for precision technology and innovative design.

Glass Cutting

FBC Cutting

Glass Shape Cutting

Glass Drilling and Slotting